TEST ELECTRONICS’ WAFER FABRICATION PALLETS
Precision Machined Super High Temperature Ceramic Pallets for Wafer Fabrication

Carrier Pallets
Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive composite boards designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens.

Pallet Features
» High strength to withstand operator abuse and repeated use without damage.
» High temperature compatibility allowing frequent cycles through ovens without warping or cracking
» Dimensional stability so that fit and alignment are the same time after time.
» Consistent conductivity on the surface and through the sheet to preserve sensitive components.
» Low heat absorption allowing the machines to run cooler and faster.
» Special pin fabrication and insertion techniques prevent loosening of circuit board alignment pins.
» Lettering provides easy to read part number labeling.

Capabilities
The many advantages of ceramic include:
» Lightness in weight
» High hardness
» Resistance to wear and corrosion
» Excellent tribological behavior
» Strength retention at high temperature
» High thermal conductivity exceeding that of other high-performance ceramics and many metal alloys.

Silicon carbide components are available in a wide range of shapes and sizes, quoted to individual customer drawings. CNC grinding capability allows tight tolerances to be held.
Silicon carbide can be provided in thin section shapes for microelectronic substrates or hard datadisks. SiC CVD coated parts and can also be supplied for special applications, such as thermocouple protection tubes.

Applications
Carriers for semiconductor wafer processing such as vacuum chucks, chemical mechanical polishing (CMP) blocks, and susceptors.

These applications take advantage silicon carbide’s thermal expansion match to silicon, high elastic modulus, chemical inertness allowing economic benefits of maintenance and reuse, and high thermal conductivity for even, rapid heating of the silicon wafer.

Silicon carbide is well suited as a structural material for low mass wafer carrier components and rigid, dimensionally stable platforms with exceptional flatness for wafer lapping and polishing.

Materials
Pallet carrier materials are available in two grades to meet your needs. All grades are lightweight, and offer advantages over aluminum, titanium and composite materials. Dimensional stability, flatness, thermal shock resistance and chemical resistance make these products ideal for the hostile environments presented in super high temperature applications.

Material Selection
We offer the industry's widest variety of pallet.
» No Carbon is non-conductive
» Silicon Carbide is semi-conductive

Typical Delivery:
5 Prototype units two weeks
50 units per week after prototype approval
100 units per week ramp up after first 100 units.

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